Vikram Pavate: search on Z-Library

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1

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Wednesday 1 October 1997)] Multilevel Interconnect Technology - Correlation between aluminum alloy sputtering target metallurgical characteristics, arc initiation, and in-film defect intensity

Pavate, Vikram, Abburi, Murali, Chiang, Sunny, Hansen, Keith, Mori, Glen, Narasimhan, Murali K., Ramaswami, Sesh, Nulman, Jaim, Restaino, Daryl, Patel, Divyesh N., Graef, Mart

Year:

1997

Language:

english

File:

PDF, 375 KB

english, 1997

2

Investigations of the structure and superconducting properties of the Pr(Ca)-Ba(La)-Cu-O system : Pr1-xCaxBa2Cu3O7-δ, PrBa2-xLaxCu3O7-δ and Pr1-xCaxBaLaCu3O7-δ

R. Nagarajan, Vikram Pavate, C.N.R. Rao

Journal:

Solid State Communications

Year:

1992

Language:

english

File:

PDF, 285 KB

english, 1992

3

Dislocations and flux pinning in YBa2Cu3O7

Eric P. Kvam, Vikram Pavate, Daniel S. Linehan

Journal:

Journal of Electronic Materials

Year:

1994

Language:

english

File:

PDF, 1.21 MB

english, 1994

4

SPIE Proceedings [SPIE Microelectronic Manufacturing - Santa Clara, CA (Sunday 20 September 1998)] Multilevel Interconnect Technology II - IMP Ta/Cu seed layer technology for high-aspect-ratio via fill by electroplating, and its application to multilevel single-damascene copper interconnects

Hashim, Imran, Pavate, Vikram, Ding, Peijun, Chin, Barry, Brown, Dirk, Nogami, Takeshi, Graef, Mart, Patel, Divyesh N.

Year:

1998

Language:

english

File:

PDF, 2.09 MB

english, 1998

5

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Wednesday 1 October 1997)] Multilevel Interconnect Technology - Integrated arc suppression unit for defect reduction in PVD applications

Li, Jason, Narasimhan, Murali K., Pavate, Vikram, Loo, David, Rosenblum, Steve, Trubell, Larry, Scholl, Richard, Seamons, Scott, Hagerty, Chris, Ramaswami, Sesh, Patel, Divyesh N., Graef, Mart

Year:

1997

Language:

english

File:

PDF, 547 KB

english, 1997

6

SPIE Proceedings [SPIE Optoelectronics and High-Power Lasers & Applications - San Jose, CA (Saturday 24 January 1998)] Flatness, Roughness, and Discrete Defects Characterization for Computer Disks, Wafers, and Flat Panel Displays II - Analysis and characterization of In-film defects generated during sputter deposition of aluminum-alloy films

Abburi, Murali, Pavate, Vikram, Chiang, Sunny, Hansen, Keith, Mori, Glen, Narasimhan, Murali K., Ramaswami, Sesh, Nulman, Jaim, Restaino, Daryl, Stover, John C.

Year:

1998

Language:

english

File:

PDF, 1.77 MB

english, 1998

7

SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] Multilevel Interconnect Technology III - Integrated IMP Ti and MOCVD TiN for 300-mm W barrier and liner for sub-0.18-μm IC processing

Tolia, Anish, Menezes, Marlon, Li, Jason, Jackson, Michael, Pavate, Vikram, Khurana, Nitin, Mosely, Rod, Narasimhan, Murali K., Chang, Mei, Chen, Fusen E., Graef, Mart, Patel, Divyesh N.

Year:

1999

Language:

english

File:

PDF, 410 KB

english, 1999

8

SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] Multilevel Interconnect Technology III - Ultrathin integrated ion metal plasma titanium and metallorganic titanium nitride liners for sub 0.18 μm W based metallization schemes for >500 MHz microprocessors

Khurana, Nitin, Pavate, Vikram, Jackson, Michael, Mandrekar, T., Fang, Z., Tolia, Anish, Luo, H., Li, Jason, Mosely, Rod, Narasimhan, Murali K., Chang, Mei, Chen, Fusen E., Graef, Mart, Patel, Divyesh

Year:

1999

Language:

english

File:

PDF, 668 KB

english, 1999

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